Partial gold plating of the connector terminals for mobile phones and smartphones.
We have established Ni barrier technology using in-house produced special drums and an inline laser stripping process, which allows us to accommodate low-profile, narrow-pitch products.
We have established Ni barrier technology through our specially manufactured drums and an inline laser stripping process, which allows us to accommodate low-profile, narrow-pitch products. Additionally, we have introduced image dimension measuring devices and video microscopes in both the manufacturing site and the quality control department to ensure a system that meets our customers' requirements. The nickel barrier prevents solder wicking during assembly and can accommodate widths as small as 0.08mm. 【Production Overview】 ■ Plating Types - Finish Plating: Hard Gold Plating - Base Plating: Nickel Plating ■ Plating Method: Hoop Plating (Inline Laser Method) ■ Specifications and materials will be addressed upon consultation. *For more details, please refer to the PDF document or feel free to contact us.
- Company：立山電化工業
- Price：Other
